Flow boiling in microchannels enhanced by parallel microgrooves fabricated on the bottom surfaces

Flow boiling in microchannels is one of the most desirable cooling solutions for high power electronics. However, it challenging to promote flow performance, particularly critical heat flux (CHF), due their unfavorable liquid rewetting. Inlet restrictors (IRs) have been successfully used manage two-phase instabilities microchannels. IRs would result extremely pressure drop. In this study, without using IRs, parallel microgrooves (W=50 µm, H=250 L=10 mm) are fabricated on bottom surface five (W=200 effectively sacrificing Our visualization study shows that these can enable rewetting at highhigh frequencies up 151 Hz and enhance thin film evaporation with highest ratio 0.65. A highly periodic mechanism substantially delay CHF conditions transfer rates. present microchannel configuration has systematically characterized mass ranging from 100 kg/m2s 600 kg/m2s. Compared plain-wall microchannels, coefficient (HTC) enhanced ~72% a 210 sustainable evaporation. Moreover, by ~155% 389 rapid enabled decorated microgrooves. We also observed enhancement HTC fades when exceeds 346 flooding.